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Handbook of Digital Techniques for High-Speed Design(2005 DjVu)

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Handbook of Digital Techniques for High-Speed Design: Design Examples, Signaling and Memory Technologies, Fiber Optics, Modeling, and Simulation to Ensure ... Sub Series: PH Signal Integrity Library) (Hardcover)by Tom Granberg (Author)


Hardcover: 976 pages Publisher: Prentice Hall PTR (June 3, 2004) Language: English ISBN-10: 013142291X ISBN-13: 978-0131422919


        Practicing engineers who work with high-speed digital designknow that a thorough, fully up-to-date resource is crucial for keeping pacewith rapidly changing technologies. Senior and graduate-level engineeringstudents need a similar resource, but with added introductory material andplenty of exercises. Only one book fills the need of both audiences—Handbookof Digital Techniques for High-Speed Design, by electronics expert TomGranberg.
This practical handbookcovers every aspect of board-level design, starting with the basics of designtrends, SerDes and bus technologies, and signal integrity. In-depth topics includememory technologies, fiber optics, modeling and simulation, design tools andthe design process, CML controlled-impedance drivers, differential andmixed-mode S-parameters, and the emerging protocols and technologies of RapidIOand PCI-Express. Tom Granberg also features major, detailed high-speed designexamples—including a BLVDS SerDes design and a design with highgigabit-per-second serial links using WarpLink devices.
This book
  • Provides detailed technical information on CML, SSTL, GTL/GTL+/GTLP, LVDS, Bus LVDS, M-LVDS, LVDM, ECL, PECL, LVPECL, HSTL, and more—plus applications best suited for each
  • Discusses IBIS and SPICE modeling and simulation, plus a full range of electronic design automation (EDA) tools
  • Emphasizes backplane and bus design with detailed guidelines and design rules
  • Covers fiber optics in detail—and when it makes sense to use them, and much more!
This book was written withtwo audiences in mind—practicing engineers who work with high-speeddigital electronics, and graduate and undergraduate-level students in collegesand universities who need to learn the concepts and techniques of high-speeddigital design before going to work in industry.

About the Author

        TOM GRANBERG has earned several technical degrees-a B.S. in Physics from Washington State University and an M.S. and Ph.D. in Electrical Engineering from the University of Missouri-Columbia. He also holds an M.B.A. from the University of Colorado at Denver. Tom has worked for dominant networking companies Cisco Systems and SkyStream Networks and in ASIC design emulation at Quickturn Design Systems (a Cadence Company). He has also worked in digital signal processing, digital imaging systems, and flat panel sensors, and at companies including Condor Systems, Martin Marietta (now Lockheed Martin), Storage Technology, and Honeywell Test Instruments. He lives in Santa Clara, California-the heart of the Silicon Valley-and enjoys access to many of the world 's newest technologies.

[ 本帖最后由 drjiachen 于 2008-10-24 23:12 编辑 ]
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彭先生  士官①  发表于 2017-12-5 15:52:29  | 显示全部楼层
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kerben  上等兵  发表于 2017-4-3 12:54:00  | 显示全部楼层
十分感谢 我会好好看书的
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cxt668  少尉  发表于 2014-5-5 22:56:09  | 显示全部楼层
来看看{:soso_e100:}
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drjiachen  版主  发表于 2008-10-24 23:11:10  | 显示全部楼层
Table of Contents

Preface.
I. INTRODUCTION.
1. Trends in High-Speed Design.
2. ASICs, Backplane Configurations, and SerDes Technology.
3. A Few Basics on Signal Integrity.

II. SIGNALING TECHNOLOGIES AND DEVICES.
4. Gunning Transceiver Logic (GTL, GTLP, GTL+, AGTL+).
5. Low Voltage Differential Signaling (LVDS).
6. Bus LVDS (BLVDS), LVDS Multipoint (LVDM), and Multipoint LVDS (M-LVDS).
7. High-Speed Transceiver Logic (HSTL) and Stub-Series Terminated Logic (SSTL).
8. Emitter Coupled Logic (ECL, PECL, LVPECL, ECLinPS Lite and Plus, SiGe, ECL Pro, GigaPro and GigaComm).
9. Current-Mode Logic (CML).
10. FPGAs - 3.125 Gbps RocketIOs and HardCopy Devices.
11. Fiber-Optic Components.
12. High-Speed Interconnects and Cabling.

III. HIGH-SPEED MEMORY AND MEMORY INTERFACES.
13. Memory Device Overview and Memory Signaling Technologies.
14. Double Data Rate SDRAM (DDR, DDR2) and SPICE Simulation.
15. GDDR3, ZBT, FCRAM, SigmaRAM, RLDRAM, DDR SRAM, Flash, FeRAM, and MRAM.
16. Quad Data Rate (QDR, QDRII) SRAM.
17. Direct Rambus DRAM (DRDRAM).
18. Xtreme Data Rate (XDR) DRAM, FlexPhase and ODR.

IV. MODELING, SIMULATION, AND EDA TOOLS.
19. Differential and Mixed-Mode S‑Parameters.
20. Time Domain Reflectometry (TDR), Time Domain Transmission (TDT), and VNAs.
21. Modeling with IBIS.
22. Mentor Graphics - EDA Tools for High-Speed Design, Simulation, Verification, and Layout.

V. DESIGN CONCEPTS AND EXAMPLES.
23. Advances in Design, Modeling, Simulation, and Measurement Validation of High-Performance Board-to-Board 5-to-10 Gbps Interconnects.

Appendix 23A. Generalized N-Port, Mixed-Mode S-Parameters.
24. IBIS Modeling and Simulation of High-Speed Fiber-Optic Transceivers.
25. Designing with LVDS.
26. Designing to 10 Gbps Using SerDes Transceivers, Serializers, and Deserializers.
27. WarpLink SerDes System Design Example.

VI. EMERGING PROTOCOLS AND TECHNOLOGIES.
28. Electrical Optical Circuit Board (EOCB).
29. RapidIO.
30. PCI Express and ExpressCard.

VII. LAB AND TEST INSTRUMENTATION.
31. Electrical and Optical Test Equipment.
以己之微·网博天下:博览微网之术·创造成功之路!
drjiachen  版主  发表于 2008-10-24 23:14:59  | 显示全部楼层
这本书包含的东西非常多,可谓是做高速数字电路人员参考手册,本人已经复印,上传的中国高速设计网下载的DjVu版本,可能不太清楚,请多见谅。
以己之微·网博天下:博览微网之术·创造成功之路!
drjiachen  版主  发表于 2008-10-24 23:26:40  | 显示全部楼层
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[ 本帖最后由 drjiachen 于 2008-10-24 23:43 编辑 ]
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drjiachen  版主  发表于 2008-10-24 23:35:29  | 显示全部楼层
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drjiachen  版主  发表于 2008-10-24 23:49:03  | 显示全部楼层
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drjiachen  版主  发表于 2008-10-24 23:54:12  | 显示全部楼层
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xugangthu  中校  发表于 2008-10-25 00:28:00  | 显示全部楼层
多谢,帮我弟下本:56bb :cacakiki13de
以己之微·网博天下:博览微网之术·创造成功之路!
drjiachen  版主  发表于 2008-10-25 10:43:43  | 显示全部楼层
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