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Printed Circuits Handbook, Sixth Edition

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Printed Circuits Handbook (McGraw Hill Handbooks) (Hardcover)by Clyde F. Coombs (Author)


Hardcover: 1000 pages Publisher: McGraw-Hill Professional; 6 edition (August 29, 2007) Language: English ISBN-10: 0071467343 ISBN-13: 978-0071467346 Product Dimensions: 9.7 x 7.8 x 2.6 inches



Product Description
The World's #1 Guide to Printed Circuit Boards_Now Completely Updated with the Latest Information on Lead-Free Manufacturing!The best reference in the field for over 30 years, the Printed Circuits Handbook equips you with definitive coverage of every facet of printed circuit assemblies_from design methods to fabrication processes. Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits.
Written by a team of experts from around the world, the Sixth Edition of this renowned handbook contains cutting-edge material on engineering and design of printed circuits fabrication methods…assembly processes… solders and soldering…test and repair…waste minimization and treatment …quality and reliability of printed circuit processes…and much more. The updated Printed Circuits Handbook provides you with:
  • Unsurpassed guidance on printed circuits_from design to manufacturing
  • Over 500 illustrations, charts, and tables for quick access to essential data
  • New to this edition: New coverage of lead-free PCB design and manufacturing techniques, lead-free materials, lead-free reliability models, best practices for High Density Interconnect (HDI), and flexible printed circuits
Inside This State-of-the-Art Printed Circuits Guide
• Introduction to Printed Circuits • Engineering and Design of Printed Circuits Fabrication Processes • Assembly Processes • Solders and Soldering • Test and Repair • Waste Minimization and Treatment • Quality and Reliability of Printed Circuit Processes • Flexible Circuits

From the Back Cover
THE ONLY SINGLE- VOLUME REFERENCE ON ALL ASPECTS OF PRINTED CIRCUIT TECHNOLOGY Defining the best in printed circuit board design and technology and unparalleled in thoroughness and reliability. COOMBS' PRINTED CIRCUITS HANDBOOK features: * 30-years' stature as the best reference in the field
* Complete, definitive coverage of every facet of printed circuit assemblies, from design methods to manufacturing processes
* Exhaustive coverage of HDI (High Density Interconnect) technologies including design, material, and microvia fabrication, sequential lamination, assembly, testing, and reliability
* Fabrication developments including blind and buried vias, controlled depth drilling, direct imaging, horizontal and pulse plating
* Base materials, including traditional and alternative laminates
* Effective quality and reliability programs, including test & inspection, acceptability criteria, reliability of boards and assemblies, process capability and control
* Multi-layer and flexible printed circuit design, fabrication and assembly
* Advanced single- and multi-chip component packaging
* Top contributors from Motorola, Cisco, Compaq, Agilent, Hewlett-Packard, and other major companies
* CD-ROM with the entire book in searchable format
* Over 1300 pages covering every facet of PCB work
* More than 700 illustrations, charts, tables, and formulas that provide ready access to needed data COOMBS' PRINTED CIRCUITS HANDBOOK is the PCB answer book, resolving more expert and workaday questions than any other single source in electronics. * The most trusted, complete, and up-to-date reference on printed circuit boards
* Ideal for broadening your expertise and for solving problems that arise every day; basics for novices and advanced technologies for experienced practitioners
* Inside: fundamentals of printed circuit design, fabrication, assembly, test, and quality THIS ONE-OF-A-KIND HANDBOOK HELPS YOU: * Apply leading-edge techniques in design, fabrication, and assembly
* Solve density/heat issues
* Easily find needed data and equations MEET THE NEED FOR SPEED AND MINIATURIZATION Advancements in semiconductor packaging have caused a "Density Revolution" in printed circuit technology, leading to dramatic process innovations in all areas of the industry. Now COOMBS' PRINTED CIRCUITS HANDBOOK, the best-selling reference in the field for 30 years, updates you on PCB design and manufacturing processes, with details from leading engineers. Their revolutionary microvia and miniaturization processes are the heart of this new edition --This text refers to an out of print or unavailable edition of this title.

About the Author
Clyde F. Coombs, Jr. (Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronic Instrument Handbook.
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drjiachen  版主  发表于 2008-10-18 15:03:52  | 显示全部楼层
Contents

Part 1: Lead-Free Legislation
Legislation and Impact on Printed Circuits

Part 2: Printed Circuit Technology Drivers
Electronic Packaging and High-Density Interconnectivity
Semiconductor Packaging Technology
Advanced Component Packaging
Types of Printed Wiring Boards

Part 3: Materials
Introduction to Base Materials
Base Material Components
Properties of Base Materials
Base Materials Performance Issues
The Impact of Lead-Free Assembly on Base Materials
Selecting Base Materials for Lead-Free Assembly Applications
Laminate Qualification and Testing

Part 4: Engineering and Design
Physical Characteristics of the PCBM
The PCB Design Process
Electrical and Mechanical Design Parameters
Current Carrying Capacity in Printed Circuits
PCB Design for Thermal Performance
Information Formatting and Exchange
Planning for Design, Fabrication, and Assembly
Manufacturing Information, Documentation, and Transfer Including CAM Tooling for Fab and Assembly
Embedded Components

Part 5: High Density Interconnection
Introduction to High-Density Interconnection (HDI) Technology
Advanced High-Density Interconnection (HDI) Technologies

Part 6: Fabrication
Drilling Processes
Precision Interconnect Drilling
Imaging
Multilayer Materials and Processing
Preparing Boards for Plating
Electroplating
Direct Plating
PWB Manufacture Using Fully Electroless Copper
Printed Circuit Board Surface Finishes
Solder Mask
Etching Process and Technologies
Machining and Routing

Part 7: Bare Board Test
Bare Board Test Objectives and Definitions
Bare Board Test Methods
Bare Board Test Equipment
HDI Bare Board Special Testing Methods

Part 8: Assembly
Assembly Processes
Conformal Costing

Part 9: Solderability Technology
Solderability: Incoming Inspection and Wet Balance Technique
Fluxes and Cleaning

Part 10: Solder Materials and Processes
Soldering Fundamentals
Soldering Materials and Metallurgy
Solder Fluxes
Soldering Techniques
Soldering Repair and Rework

Part 11: Nonsolder Interconnection
Press-Fit Interconnection
Land Grid Array Interconnect

Part 12: Quality
Acceptability and Quality of Fabricated Boards
Acceptability of Printed Circuit Board Assemblies
Assembly Inspection
Design for Testing
Loaded Board Testing

Part 13: Reliability
Conductive Anodic Filament Formation
Reliability of Printed Circuit Assemblies
Component-to-PWB Reliability: The Impact of Design Variables and Lead Free
Component-to-PWB Reliability: Estimating Solder-Joint Reliability and the Impact of Lead-Free Solders

Part 14: Environmental Issues
Process Waste Minimization and Treatment

Part 15: Flexible Circuits
Flexible Circuit Applications and Materials
Design of Flexible Circuits
Manufacturing of Flexible Circuits
Termination of Flexible Circuits
Multilayer Flex and Rigid/Flex
Special Constructions of Flexible Circuits
Quality Assurance of Flexible Circuits

Index
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