介质厚度和地板宽度对陶瓷多芯片模块中多层共面部件和电路的影响:ABSTRACT: This article investigates the effect of dielectric thickness
and ground width on the performance of multilayer conductor backed
coplanar waveguide lumped elements and circuits fabricated on
advanced multilayer photoimageable thick-film ceramic multichip
module (MCM) technology.
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DIELECTRIC THICKNESS AND GROUND WIDTHＥＦＦＥＣＴ.pdf
