减小碳纤维增强碳基复合材料封装的高功率放大器的热阻:Abstract—This paper deals with the thermal design of an
electronics package and a demonstration of reduced thermal
resistance for high-power amplifiers (HPAs). The focus is package
internal thermal management. A carbon fiber-reinforced carbon
composite- (C/C composite) based heat sink is proposed as
a means of enhancement over the more conventional CuMo
material.
减小碳纤维增强碳基复合材料封装的高功率放大器的热阻: Reduction of Thermal Resistance of High-Power Amplifiers.pdf
