三维集成电路中高密度金属-金属间互连键合:In this paper, we report on the fabrication and bonding of
large area array test devices with high yield Cu–Cu and Cu/Sn–
Cu bonding processes. Bonding was performed without the use
of resins or fixing agents.
好资料，顶起！
工艺方面的资料不好找啊
High Density Metal–Metal Interconnect Bonding.pdf
