在宽温度范围热循环下无引线焊点的可靠性:Abstract—In this paper, we report a comprehensive set of
accelerated thermal cycling (ATC) tests that were performed
on test vehicles with different package types, sizes, pitches, and
solder joint alloy metallurgies using four different thermal cycling
profiles: 0 to 100, −40 to 125, −55 to 125, and −60 to 150 °C.
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在宽温度范围热循环下无引线焊点的可靠性: Reliability of Lead-Free Solder Joints.pdf
