有点多，呵呵
1.
Coupling of through-hole signal via to power/ground resonance and excitation of edge radiation in multi-layer PCB Jun So Pak; Jingook Kim; Jung-Gun Byun; Heejae Lee; Joungho Kim;
Electromagnetic Compatibility, 2003 IEEE International Symposium on
Volume: 1
Digital Object Identifier:
10.1109/ISEMC.2003.1236597
Publication Year: 2003 , Page(s): 231 - 235 vol.1
Cited by: 1
2.
Relative Permittivity Variation Surrounding PCB Via Hole Structures Simonovich, L.;
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Digital Object Identifier:
10.1109/SPI.2008.4558362
Publication Year: 2008 , Page(s): 1 - 4
Cited by: 1
3.
A PCB-compatible 3-dB coupler using microstrip-to-CPW via-hole transitions Jui-Chieh Chiu; Jih-Ming Lin; Mau-Phon Houng; Yeong-Her Wang;
Microwave and Wireless Components Letters, IEEE
Volume: 16 ,
Issue: 6
Digital Object Identifier:
10.1109/LMWC.2006.875592
Publication Year: 2006 , Page(s): 369 - 371
Cited by: 6
IEEE Journals
4.
A New Via Hole Structure of MLB (Multi-Layered Printed Circuit Board) for RF and High Speed Systems IEEE Conferences
5.
An RFID Antenna design for multi-layered printed circuit board applications Jung-Chin Hsieh; Ming-Iu Lai; Shyh-Kang Jeng;
Antennas and Propagation Society International Symposium, 2007 IEEE
Digital Object Identifier:
10.1109/APS.2007.4395492
Publication Year: 2007 , Page(s): 309 - 312
IEEE Conferences
6.
Electrical characterization of multi-layered printed circuit boards Guastavino, F.; Centurioni, L.; Coletti, G.; Ratto, A.; Torello, E.;
Electrical Insulation and Dielectric Phenomena, 2004. CEIDP '04. 2004 Annual Report Conference on
Digital Object Identifier:
10.1109/CEIDP.2004.1364318
Publication Year: 2004 , Page(s): 588 - 591
7.
On the modeling of radiation from cables attached to multi-layered printed circuit boards Bokhari, S.A.;
Electromagnetic Compatibility, 1997. IEEE 1997 International Symposium on
Digital Object Identifier:
10.1109/ISEMC.1997.667687
Publication Year: 1997 , Page(s): 272 - 276
Cited by: 1
IEEE Conferences
8.
Novel Application and Advantage of Reverse Blind Microvia (RBMV) on PCB Po-Yao Chuang; Ming-Tsun Lu; Chi-Ying Wu;
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Digital Object Identifier:
10.1109/IMPACT.2008.4783816
Publication Year: 2008 , Page(s): 94 - 97
IEEE Conferences
9.
Nickel characterization for interconnect analysis Shlepnev, Y.; McMorrow, S.;
Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on
Digital Object Identifier:
10.1109/ISEMC.2011.6038368
Publication Year: 2011 , Page(s): 524 - 529
10.
Analytical Prediction of Crosstalk Among Vias in Multilayer Printed Circuit Boards Wu, S.; Fan, J.;
Electromagnetic Compatibility, IEEE Transactions on
Volume: PP ,
Issue: 99
Digital Object Identifier:
10.1109/TEMC.2011.2179658
Publication Year: 2012 , Page(s): 1 - 8
11.
Understanding the variables of dielectric constant for PCB materials used at microwave frequencies IEEE Conferences
12.
Crosstalk Analysis Between Non-Parallel Coupled Lines Connected With Vias in a 4-layer PCB Jae Kwon Han; Dong Chul Park;
Environmental Electromagnetics, The 2006 4th Asia-Pacific Conference on
Digital Object Identifier:
10.1109/CEEM.2006.258057
Publication Year: 2006 , Page(s): 728 - 731
13.
Resonance stub effect in a transition from a through via hole to a stripline in multilayer PCBs Kushta, T.; Narita, K.; Kaneko, T.; Saeki, T.; Tohya, H.;
Microwave and Wireless Components Letters, IEEE
Volume: 13 ,
Issue: 5
Digital Object Identifier:
10.1109/LMWC.2003.811678
Publication Year: 2003 , Page(s): 169 - 171
Cited by: 13
IEEE Journals
14.
CPW-to-CPW via-connected vertical transition for millimeter wave applications IEEE Conferences
15.
Fabrication of high quality factor RF-solenoids using via structures Kamali-Sarvestani, R.; Williams, J.D.;
Wireless and Microwave Technology Conference (WAMICON), 2011 IEEE 12th Annual
Digital Object Identifier:
10.1109/WAMICON.2011.5872901
Publication Year: 2011 , Page(s): 1 - 4
16.
A Power Plane With Wideband SSN Suppression Using a Multi-Via Electromagnetic Bandgap Structure Mu-Shui Zhang; Yu-Shan Li; Chen Jia; Li-Ping Li;
Microwave and Wireless Components Letters, IEEE
Volume: 17 ,
Issue: 4
Digital Object Identifier:
10.1109/LMWC.2007.892992
Publication Year: 2007 , Page(s): 307 - 309
Cited by: 5
求IEEE关于ltcc via的论文，重谢: Analytical Prediction of Crosstalk Among Vias in Multilayer Printed Circuit Boards.pdf
