下一代频率1-110GHz 低介电常数低损耗薄介质的特性: Characterization of Next Generation Thin Low-K and.pdf

Abstract—This paper presents, for the first time, characterization results of next generation dielectric core and build up material
called RXP, which has low dielectric constant (2.93–3.48) and low loss tangent (0.0037–0.006) up to 110 GHz. Unlike LCP, this material can be made ultra-thin with low processing temperature and is ideally suited for mobile applications. Causal models suitable for high frequency applications have been extracted by measuring the response of cavity resonators using vector network analyzer and surface profiler.

下来看看学习，超高频低损耗介质的发展确实引人注目

材料学发展很迅速啊

真是快速啊，支持

好文章！{:7_1257:}

一代材料 一代产品

灌水文章, 只给出DK, DF 有鸟用， 现在的高频微波基材还是PTFE，和PI， LCP没多少份额

{:7_1235:}

学习下