本帖最后由 calabazas 于 2010-4-16 19:07 编辑
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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging 2008
by Jong-Hoon Lee, Manos M. Tentzeris
(共8分卷, 依序由上而下,档案大,恕不另传,下次改进,此书介绍三维封装硬件,适millimeter方面应用)
[ToC]
1.Introduction ...1
2.Background on Technologies for Millimeter-Wave Passive Front-Ends ...5
2.1 3D Integrated SOP Concept ...5
2.2 LTCC Multilayer Technology ...7
2.3 60 GHz Transmitter/Receiver Modules ...8
3.Three-Dimensional Packaging in Multilayer Organic Substrates ...11
3.1 Multilayer LCP Substrates ...11
3.2 RF MEMS Packaging Using Multilayer LCP Substrates ...12
3.2.1 Package Fabrication ...13
3.2.2 RF MEMS Switch Performance with Packaged Cavities ...13
3.2.3 Transmission Lines with Package Cavities ...16
3.3 Active Device Packaging Using Multilayer LCP Substrates ...16
3.3.1 Embedded MMIC Concept...17
3.3.2 MMIC Package Fabrication ...18
3.3.3 MMIC Package Testing ...18
3.4 Three-Dimensional Paper-Based Modules for RFID/Sensing Applications ...21
4.Microstrip-Type Integrated Passives ...23
4.1 Patch Resonator Filters and Duplexers ...23
4.1.1 Single Patch Resonator ...23
4.1.2 Three and Five-Pole Resonator Filters ...27
4.2 Quasielliptic Filter ...32
5.Cavity-Type Integrated Passives ...37
5.1 Rectangular Cavity Resonator ...37
5.2 Three-Pole Cavity Filters ...39
5.3 Vertically Stacked Cavity Filters and Duplexers ...47
5.3.1 Design of Cavity Resonator ...47
5.3.2 Design of Three-Pole Cavity Bandpass Filter ...48
5.4 Cavity-Based Dual-Mode Filters ...56
5.4.1 Dual-Mode Cavity Filters ...57
5.4.1.1 Single Dual-Mode Cavity Resonator ...57
5.4.1.2 Internal Coupling ...59
5.4.1.3 External Coupling ...59
5.4.1.4 Transmission Zero ...61
5.4.1.5 Quasi-Elliptic Dual-Mode Cavity Filter ...64
5.4.2 Multipole Dual-Mode Cavity Filters ...67
5.4.2.1 Quasi-Elliptic Filter with a Rectangular Slot ...70
5.4.2.2 Quasi-Elliptic Filter with a Cross Slot ...72
6.Three-Dimensional Antenna Architectures ...73
6.1 Patch Antenna Using a Soft-Surface Structure ...73
6.1.1 Investigation of an Ideal Compact Soft Surface Structure ...73
6.1.2 Implementation of the Soft-Surface Structure in LTCC...76
6.2 High-Gain Patch Antenna Using Soft-Surface Structure and Stacked Cavity...79
6.2.1 Antenna Structure Using a Soft-Surface and Stacked Cavity ...79
6.2.2 Simulation and Measurement Results ...81
6.3 Dual-Polarized Cross-Shaped Microstrip Antenna ...83
6.3.1 Cross-Shaped Antenna Structure ...84
6.3.2 Simulation and Measurement Results ...85
6.4 Series-Fed Antenna Array ...86
6.4.1 Antenna Array Structure ...87
6.4.2 Simulation and Measurement Results ...89
7.Fully Integrated Three-Dimensional Passive Front-Ends ...91
7.1 Passive Front-Ends for 60 GHz Time-Division Duplexing (TDD) Applications ...91
7.1.1 Topologies...91
7.1.2 Performance Discussion ...91
7.2 Passive Front-Ends for 60 GHz Frequency-Division Duplexing Applications ...92
7.2.1 Topologies...93
7.2.2 Performance Discussion ...97
References ...99
介绍一本书 Three-Dimensional Integration and Modeling 2008: Three-Dimensional Integration and Modeling 2008.part1.rar
