LTCC Components & Modules（World Markets, Technologies & Opportunities）: 本帖最后由 xmub 于 2009-11-4 16:40 编辑
[local]LTCC Components & Modules:
World Markets, Technologies & Opportunities: 2002-2007
Technical-Economic Analysis[/local]
TABLE OF CONTENTS:
TABLE OF CONTENTS: .................................................................................................................................... 2
EXECUTIVE SUMMARY:................................................................................................................................. 5
Technology Description:............................................................................................................................. 5
LTCC Component & Module Market & Product Description:.................................................................. 5
Technology Description & Benefits: ........................................................................................................... 6
Products Produced From LTCC: ................................................................................................................ 7
Benefit Of LTCC Components and Modules:.............................................................................................. 8
Current Market Size For LTCC Components and Modules: 2002 ............................................................ 8
Market Drivers For LTCC Components and Modules: 2002 .................................................................... 9
The 0201 Case Size MLCC & ChipR- LTCC Enablers .............................................................................. 9
Major-End Use Markets For LTCC Components and Modules: 2002.................................................... 10
Major Individual Product Markets For LTCC Components and Modules: 2002................................... 10
LTCC Component and Module Market Growth Forecasts: 2002-2003 .................................................. 11
Long-Term LTCC Component and Module Market Growth Forecasts: 2002-2007............................... 12
Competitive Environment In LTCC Components and Modules:.............................................................. 12
Competition With FR4 Modules:............................................................................................................... 13
Additional Gaps and Showstoppers in LTCC Component and Module Markets:................................... 13
Potential For A Future Shift in The Component Supply Chain Model:................................................... 14
TECHNOLOGY OVERVIEW:.......................................................................................................................... 15
New Directions In Packaging:................................................................................................................... 15
LTCC For Commercial Markets: .............................................................................................................. 15
LTCC Materials Requirements:................................................................................................................. 15
LTCC Production Process:....................................................................................................................... 20
GLOBAL MARKETS:....................................................................................................................................... 25
KEY POSITIVE ASPECTS OF THEMARKET CONTRIBUTING TO GROWTH:..................................................... 25
Current Market Size & Forecasts: ............................................................................................................ 25
LTCC Component and Module Unit Shipment Analysis:......................................................................... 26
LTCC Component & Module Markets By World Region: 2001-2007..................................................... 27
LTCC Component Markets By End-Use Market Segment: 2001-2007 ................................................... 30
LTCC Component & Module Suppliers: 2001 Sales & Market Shares................................................... 31
Product Applications for LTCC Components & Modules: ...................................................................... 33
Sample Pricing: LTCC Components & Modules: .................................................................................... 37
LTCC Component & Module Price Erosion Forecasts: 2002-2007........................................................ 38
LTCC Supply Chain Value (Raw Material To Component/Module):...................................................... 39
Structure of The LTCC Supply Chain: ...................................................................................................... 41
......................................................................................................................................................................... 42
LTCC PRODUCT TYPES & MARKETS: ............................................................................................................ 43
Monolithic LTCC Substrate Markets: ....................................................................................................... 43
Multilayer LTCC Board Markets: ............................................................................................................. 43
Single Cavity LTCC Package Markets:..................................................................................................... 43
Multiple Cavity LTCC Package Markets:................................................................................................. 43
Multiple Material LTCC Package Markets: ............................................................................................. 43
LTCC COMPONENTS & MODULES-COMPETITIVE ENVIRONMENT:............................................................... 44
LTCC Suppliers For Telecommunications Applications By Type: .......................................................... 44
LTCC Activity Level in Telecommunications By Circuit Function: 2002 ............................................... 45
LTCC Suppliers For Automotive Applications By Type:.......................................................................... 49
Sensor Module Markets:........................................................................................................................... 50
GPS Module Markets:............................................................................................................................... 50
LTCC Suppliers For Defense & Aerospace Applications By Type:......................................................... 51
LTCC Suppliers For Computer Applications By Type:............................................................................ 52
Laptop Bluetooth Antenna Markets: ......................................................................................................... 53
LTCC Suppliers For Medical Electronics Applications By Type: ........................................................... 53
LTCC SUPPLIERS FOR CONSUMER ELECTRONICS APPLICATIONS BY TYPE: ................................................ 54
LTCC SUPPLIERS FOR “OTHER” APPLICATIONS BY TYPE: .......................................................................... 55
MARKET DRIVERS: ......................................................................................................................................... 57
The Case For Integration and Modularization: ....................................................................................... 57
Introduction:.............................................................................................................................................. 57
Integration History: .................................................................................................................................. 57
Integrated Passive Components & Modules: Market Size & Forecasts: 2001-2007.............................. 59
LTCC Component & Module Markets: 2001-2007 .................................................................................. 59
FR4 Module Markets: 2001-2007 ............................................................................................................. 60
Traditional Passive Network Markets: 2001-2007: ................................................................................. 61
Driving Factors Behind The Growth Of Integration:............................................................................... 63
Passive Component Content By Phone Protocol:..................................................................................... 65
Passive Component Content By Type In Cellular Phones: Ericcson SH88 ............................................ 66
MLCC In Wireless: Teardown by Case Size:............................................................................................ 67
Passive Component Content In Laptop Computers:................................................................................. 68
Automotive Subassemblies:....................................................................................................................... 71
Digital Camera: ........................................................................................................................................ 72
Technology Platforms For Passive Component Integration:................................................................... 72
Raw Material Support:.............................................................................................................................. 73
Integration In Motion: Gaps & Showstoppers: Discrete Integration...................................................... 74
Suggested Solutions For Passive Integration: .......................................................................................... 75
Synergistic Technology Platforms:............................................................................................................ 76
Setting The Stage For The Future:............................................................................................................ 77
Major Customer Segments: ....................................................................................................................... 78
Major LTCC Suppliers: ............................................................................................................................. 78
Competition With FR4: .............................................................................................................................. 79
Component Integration Vs. Material Manipulation:................................................................................ 79
Future Directions:..................................................................................................................................... 80
RAW MATERIALS: .......................................................................................................................................... 81
LTCC Raw Materials Markets: 2001-2007: ............................................................................................. 81
LTCC Tape Markets: ................................................................................................................................ 81
Tape Suppliers: Captive & Merchant: 2001 Sales & Market Shares...................................................... 83
Tape Suppliers: Merchant Only: 2001 Sales & Market Shares............................................................... 84
LTCC Tape Raw Material Markets:.......................................................................................................... 84
LTCC Tape- Raw Material Markets.......................................................................................................... 85
LTCC Metallization Market: ..................................................................................................................... 87
Market Dichotomy in Metallization (Japan Vs. The West) ...................................................................... 87
FORECASTS:..................................................................................................................................................... 88
Rationalization For LTCC Component and Module Forecasts:.............................................................. 88
General High-Tech Economy Forecasts:.................................................................................................. 88
LTCC Component and Module Demand Forecasts By End-Use Market Segment: 2003-3007 ............. 89
Wireless Communications Markets & Forecasts: .................................................................................... 91
Automotive Electronic Subassemblies: ..................................................................................................... 93
Telecommunications Infrastructure Equipment: ...................................................................................... 96
Defense Electronic Markets: ..................................................................................................................... 98
Medical Electronics Markets:.................................................................................................................... 99
Emerging Markets For LTCC Components & Modules: 2003-2007..................................................... 101
LTCC Bluetooth Module Penetration Forecasts By Product Market: 2002-2007................................ 107
COMPETITIVE INTELLIGENCE:.................................................................................................................. 109
MURATA CONTACT INFORMATION: .............................................................................................................. 113
KYOCERA/AVX CONTACT INFORMATION: .................................................................................................. 124
Kyocera Contacts:................................................................................................................................... 124
AVX Corporation (a Kyocera subsidiary traded separately on the NYSE) ........................................... 125
ROBERT BOSCH CONTACT INFORMATION:.................................................................................................... 127
TDK CORPORATION CONTACT INFORMATION:............................................................................................ 134
TAIYO YUDEN CONTACT INFORMATION:...................................................................................................... 139
CTS CORPORATION CONTACT INFORMATION:............................................................................................. 144
National Semiconductor Contact Information:....................................................................................... 147
C-Mac Contact Information: ................................................................................................................... 152
EPCOS Contact Information:.................................................................................................................. 154
Sorep Erulec Contact Information: ......................................................................................................... 158
Dupont Electronics Contact Information:............................................................................................... 160
SMI-ED Contact Information:................................................................................................................. 162
CeramTec Contact Information............................................................................................................... 164
Nikko Contact Information:.................................................................................................................... 167
Grumman Contact Information:.............................................................................................................. 168
Ferro Contact Information:.................................................................................................................... 172
Hereaus Contact Information:................................................................................................................. 173
ESL Contact Information:....................................................................................................................... 174
Electro-Science Labs............................................................................................................................... 174
Harris Corporation Contact Information: .............................................................................................. 174
NEG Contact Information: ...................................................................................................................... 175
Soshin Contact Information:................................................................................................................... 176
MSE Contact Information:...................................................................................................................... 178
ACX Contact Information:...................................................................................................................... 179
VIA electronic Contact Information:....................................................................................................... 180
Microtel Contact Information: ................................................................................................................ 182
Samsung EMCO Contact Information: ................................................................................................... 187
Matsushita Contact Information: ............................................................................................................ 189
Yageo Contact Information: .................................................................................................................... 194
Lamina Ceramics Contact Information: ................................................................................................. 195
Selmic Contact Information:................................................................................................................... 196
Pilkor Contact Information: .................................................................................................................... 197
ATC Contact Information: ....................................................................................................................... 198
Walsin Contact Information: ................................................................................................................... 200
Darfon Contact Information:................................................................................................................... 201
Dielectric Labs Contact Information: ..................................................................................................... 202
Morgan Electro Ceramics Contact Information:.................................................................................... 203
PAUMANOK DATABASE OF LTCC CONTACTS AND RESOURCES.............................................. 205
这么高的价钱啊！既然共享了就意思一下算了啊！
还不错的书籍
好贵的帖子啊
贵了点喔，看看
感谢楼主分享
不错，就是有点贵~
虽然贵点，但是理解没钱的兄弟，支持了
:crackle.GIF
贵点还是买了
貌似以后用得着这方面
了解了解下
谢谢楼主分享
:crackle.GIF
这个要看。不过为什么没有置顶呢？
好像没怎么讲技术呀。
还是先不下了
這個對初學者幫助不大.....沒有設計經驗可參考!!
是材料就下，空了慢慢看
学习、支持、感谢
谢谢分享！
谢谢分享！
支持
支持
thank you very much !
还不错，就是老了点
多谢楼主~~~~
谢谢分享
不愿做奴隶的人民，愿做人民币的奴隶。
楼主，支持！
LTCC Components & Modules.pdf
