《Practical MMIC Design》Steve Marsh 2006:Contents
Foreword xiii
Preface xv
1 Introduction 1
1.1 Introduction to MMICs 2
1.2 The History of MMICs 3
1.3 The MMIC Advantage 6
1.4 Basic Design Process 7
References 8
2 Component Technology and Foundry Choice 11
2.1 Active Components 12
2.1.1 Substrate Material 12
2.1.2 Transistor Type 14
2.1.3 Transistor Response Versus Frequency 30
2.2 Passive Components 31
2.2.1 Diodes 31
2.2.2 Transmission Lines 31
2.2.3 Resistors 42
2.2.4 Capacitors 44
2.2.5 Inductors 46
2.2.6 Metal Layer Interconnects 49
2.2.7 Bond-pads 49
2.2.8 Substrate Vias 50
2.3 Questions 50
References 52
3 Foundry Use and Economics 57
3.1 Using a Foundry 57
3.1.1 Agreements and Discussions 57
3.1.2 Delivery of Design Data 59
3.1.3 Circuit Design 59
3.1.4 Design Review 60
3.1.5 Wafer Fabrication 60
3.1.6 Test and Delivery 61
3.2 Economics 61
3.2.1 MMIC Production Costs 61
3.2.2 Defect Densities 62
References 64
4 Simulation and Component Models 65
4.1 Simulation 66
4.1.1 The s-parameters 66
4.1.2 Component Characterization 69
4.1.3 Model Development 71
4.1.4 Linear Simulation 74
4.1.5 Nonlinear Simulation 74
4.1.6 2D, 2.5D, and 3D Electromagnetic Simulation 75
4.2 Passive Component Models 76
4.2.1 Capacitors 76
4.2.2 Inductors 77
4.2.3 Resistors 78
4.2.4 Vias 79
4.2.5 Transmission-Line Discontinuities 79
4.3 Active Component Models 82
4.3.1 FET Model 83
4.3.2 HBT Model 84
4.4 Questions 84
References 85
5 Design 89
5.1 Impedance Matching and the Smith Chart 90
5.1.1 Matching 90
5.1.2 Smith Chart 92
5.1.3 Converting Impedance to Reflection Coefficient 95
5.1.4 Converting Impedance to Admittance 96
5.1.5 Deriving the Conjugate Impedance 96
5.1.6 Transforming a Load Impedance Along a Lossless
Transmission Line 97
5.1.7 Addition of Series Reactive and Shunt Susceptance
Lumped Elements 99
5.1.8 T and Pi Matching Circuits 103
5.1.9 Curves of Constant Q-factor 104
5.1.10 Circles of Constant Performance 105
5.2 Passive Elements 108
5.2.1 Open Circuit and Short Circuit Stubs 108
5.2.2 Radial Stubs 109
5.2.3 Couplers, Splitters, and Combiners 110
5.2.4 Baluns 122
5.2.5 Filters 123
5.2.6 Antennas 124
5.3 Amplifiers 125
5.3.1 Initial Considerations 126
5.3.2 Small-Signal Amplifiers 132
5.3.3 Power Amplifiers 147
5.4 Oscillators 188
5.4.1 Oscillation Principles 189
5.5 Mixers 194
5.5.1 MMICMixers 196
5.6 Switches 207
5.7 Phase Shifters 210
5.7.1 Reflective Phase Shifters 210
5.7.2 Loaded-Line Phase Shifters 211
5.7.3 Switched-Delay-Line Phase Shifters 211
5.7.4 Switched-Filter Phase Shifters 211
5.8 Switched-Path Attenuators 213
5.9 Circuits with Digital Application 214
5.9.1 Prescalers 214
5.9.2 Logarithmic Amplifiers 215
5.9.3 Darlington Pair Amplifiers 216
5.10 Millimeter-Wave Circuits 216
5.10.1 High-Frequency Effects 217
5.10.2 Component Choice 221
5.10.3 Simulation Issues 228
5.11 Yield Improvement 231
5.11.1 What Is the MMIC Yield? 232
5.11.2 Yield-Improvement Techniques 234
5.12 Questions 246
References 250
6 Layout 261
6.1 Layout Files 262
6.2 Circuit Layout Process 264
6.3 Layout Checking 267
6.3.1 Layout Design Rules 267
6.3.2 Design Rule Checking 269
6.3.3 Electrical Rule Checking 270
6.3.4 Layout Versus Schematic 270
6.3.5 Reverse Engineering 270
6.3.6 Visual Checking 270
6.4 Chip Arraying 270
6.4.1 Chip Identifiers 271
6.4.2 Arraying Guidelines 273
6.5 Mask Manufacture 274
6.6 Layout Examples 274
6.7 Questions 277
References 277
7 Processing Technology 279
7.1 Substrate Material Growth 280
7.2 Wafer Production 283
7.3 Surface Layers 283
7.4 Photolithography 285
7.4.1 Typical MMIC Photolithographic Steps 288
7.4.2 Device Isolation 290
7.4.3 Ohmic Contacts 291
7.4.4 Gate Contacts 293
7.4.5 First Interconnect Metal 296
7.4.6 High-Dielectric-Constant Layer 296
7.4.7 Resistive Metal 298
7.4.8 Low-Dielectric-Constant Layer 298
7.4.9 Second Interconnect Metal 299
7.4.10 Dielectric Encapsulation and Saw/Scribe
Lane Definition 301
7.5 Wafer Thinning 302
7.6 Through-Substrate Vias 304
7.7 Back-Face Metal 305
7.8 Chip Separation 306
7.9 Quality Assurance 306
7.10 Questions 308
References 309
8 Test 313
8.1 Process Control and Monitoring (PCM) 313
8.2 The dc Test and Stability Problems 314
8.3 RF Testing and Calibration 315
8.4 Questions 319
References 320
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对MMIC的实际设计非常有指导意义,推荐!
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对MMIC的实际设计非常有指导意义,推荐!
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