Production Testing of Rf and System-On-A-Chip Devices for Wireless Communications(HRD)
作者：Schaub 作者：Keith B./ Kelly 作者：Joe - 出版社：Artech House
- ISBN号：158053692
- 页数：272
- 出版日期：2004-01-04
- Chapter 1 provides an overview of the many facets of production testing, with
particular focus on the testing of RF and SOC devices. Many of the topics also
directly work for other types of electronic device production testing. Additionally,
the various capital expense items are covered, such as handlers, wafer probers, load
boards, contactors, and so forth. There are not many general information application
notes available on these topics, and this chapter is intended to bring them
together to one location.
Chapter 2 introduces the devices, both RF and SOC, that this book focuses on.
A review of how the radio has evolved in wireless communications is presented. The
superheterodyne radio and direct conversion (zero-if) architectures are discussed, as
are their changes over time and their impact on testing. Lastly, an overview of the
types of tests that are performed on each type of device is presented.
Cost of test is reviewed in Chapter 3. An in-depth analysis is presented in this
chapter with the intention to be a guide for those making decisions on how to implement
final tests of devices. Note that this chapter, while presented in a book on RF
testing, can be applied equally to any other type of electronic device or wafer testing.
The intention is for this chapter to be useful to managers, sales teams, and applications
engineers who go beyond the role of sitting behind the tester. Also presented in
this chapter is a discussion of the traditional models of production test. Topics considered
include the advantages and disadvantages of using third-party-testing integrated
design manufacturers (IDMs) versus subcontract manufacturers (SCMs). An
analytical tool will be presented for calculating cost of test, including many necessary
components that are often overlooked when deciding how to perform production
testing.
Algorithms for production tests performed on discrete RF devices, as well as the
front end of more highly integrated devices are presented in Chapter 4, the beginning
of the handbook-type portion of this book. Detailed descriptions of the tests, as well
as algorithms in both tabular and block diagram formats, are provided.
Following the format of Chapter 4, Chapter 5 provides algorithms on measurements
used with more highly integrated SOC devices. The tests discussed in this section
are typical of those found in wireless communications.
Chapter 6 is an introduction to many facets of mixed-signal testing. Common
tests that are finding their way into SOC device production testing are explained.
Chapter 7 covers new methods for improving the efficiency of production testing,
taking it beyond simply performing the measurements faster. Concepts such as
parallel and concurrent testing are presented.
Chapter 8 is dedicated to the measurement of noise. Both noise figure and phase
noise measurements are discussed. The intention of this chapter is to educate the
engineer in what goes on behind the scenes of today’s easy-to-use noise figure analyzers
and automated test equipment (ATE). Gone are the days when the engineer
had to manually extract noise measurements, but it is important to understand the
algorithms, which even today, within analyzers, effectively remain unchanged.
There is further explanation on how to perform noise measurements in a
production-test environment. Phase noise is also be considered and examined.
Appendixes 4A, A, and B are included to cover the common items that every
engineer is often running hastily to find from their notes.
We look forward to helping to merge the worlds of RF and mixed-signal production
testing.
Contents
Preface xiii
Acknowledgments xvii
CHAPTER 1
An Introduction to Production Testing 1
1.1 Introduction 1
1.2 Characterization Versus Production Testing 1
1.3 The Test Program 2
1.4 Production-Test Equipment 2
1.5 Rack and Stack 2
1.6 Automated Test Equipment 3
1.7 Interfacing with the Test Equipment 3
1.7.1 Handlers 3
1.7.2 Load Boards 5
1.7.3 Contactor Sockets 5
1.7.4 Production RF and SOC Wafer Probing 6
1.8 Calibration 9
1.9 The Test Floor and Test Cell 10
1.10 Test Houses 10
1.11 Accuracy, Repeatability, and Correlation 10
1.12 Design for Testing 11
1.13 Built-in Self-Test 11
References 12
CHAPTER 2
RF and SOC Devices 13
2.1 Introduction 13
2.2 RF Low Noise Amplifier 15
2.3 RF Power Amplifier 15
2.4 RF Mixer 16
2.5 RF Switch 19
2.6 Variable Gain Amplifier 20
2.7 Modulator 22
2.8 Demodulator 23
2.9 Transmitter 24
2.10 Receiver 24
2.11 Transceiver 25
2.12 Wireless Radio Architectures 26
2.13 Superheterodyne Wireless Radio 26
2.14 Zero Intermediate Frequency Wireless Radio 26
2.15 Phase Locked Loop 28
2.16 RF and SOC Device Tests 30
References 31
CHAPTER 3
Cost of Test 33
3.1 Introduction 33
3.2 Wafer Processing Improves Cost of Test 33
3.3 Early Testing of the SOC 36
3.4 SCM and IDM 37
3.5 SOC Cost-of-Test Paradigm Shift 37
3.6 Key Cost-of-Test Modeling Parameters 38
3.6.1 Fixed Cost 39
3.6.2 Recurring Cost 39
3.6.3 Lifetime 40
3.6.4 Utilization 40
3.6.5 Yield 41
3.6.6 Accuracy as It Relates to Yield 42
3.7 Other Factors Influencing COT 45
3.7.1 Multisite and Parallel Testing 45
3.7.2 Test Engineer Skill 46
3.8 Summary 46
References 46
CHAPTER 4
Production Testing of RF Devices 49
4.1 Introduction 49
4.2 Measuring Voltage Versus Measuring Power 49
4.3 Transmission Line Theory Versus Lumped-Element Analysis 50
4.4 The History of Power Measurements 51
4.5 The Importance of Power 52
4.6 Power Measurement Units and Definitions 53
4.7 The Decibel 53
4.8 Power Expressed in dBm 54
4.9 Power 54
4.10 Average Power 55
4.11 Pulse Power 56
4.12 Modulated Power 56
4.13 RMS Power 57
4.14 Gain 58
4.14.1 Gain Measurements of Wireless SOC Devices 60
4.15 Gain Flatness 61
4.15.1 Measuring Gain Flatness 63
4.15.2 Automatic Gain Control Flatness 65
4.16 Power-Added Efficiency 67
4.17 Transfer Function for RF Devices 68
4.18 Power Compression 69
4.19 Mixer Conversion Compression 72
4.20 Harmonic and Intermodulation Distortion 72
4.20.1 Harmonic Distortion 73
4.20.2 Intermodulation Distortion 75
4.20.3 Receiver Architecture Considerations for
Intermodulation Products 79
4.21 Adjacent Channel Power Ratio 79
4.21.1 The Basics of CDMA 79
4.21.2 Measuring ACPR 81
4.22 Filter Testing 82
4.23 S-Parameters 84
4.23.1 Introduction 84
4.23.2 How It Is Done 84
4.23.3 S-Parameters of a Two-Port Device 85
4.23.4 Scalar Measurements Related to S-Parameters 86
4.23.5 S-Parameters Versus Transfer Function 88
4.23.6 How to Realize S-Parameter Measurements 89
4.23.7 Characteristics of a Bridge 89
4.23.8 Characteristics of a Coupler 90
4.24 Summary 91
References 92
Appendix 4A: VSWR, Return Loss, and Reflection Coefficient 93
CHAPTER 5
Production Testing of SOC Devices 95
5.1 Introduction 95
5.2 SOC Integration Levels 96
5.3 Origins of Bluetooth 97
5.4 Introduction to Bluetooth 98
5.5 Frequency Hopping 99
5.6 Bluetooth Modulation 100
5.7 Bluetooth Data Rates and Data Packets 100
5.8 Adaptive Power Control 102
5.9 The Parts of a Bluetooth Radio 102
5.10 Phase Locked Loop 103
5.11 Divider 104
5.12 Phase Detector, Charge Pumps, and LPF 104
5.13 Voltage Controlled Oscillator 104
5.14 How Does a PLL Work? 104
5.15 Synthesizer Settling Time 105
5.16 Testing Synthesizer Settling Time in Production 106
5.17 Power Versus Time 106
5.18 Differential Phase Versus Time 110
5.19 Digital Control of an SOC 112
5.20 Transmitter Tests 113
5.20.1 Transmit Output Spectrum 114
5.20.2 Modulation Characteristics 117
5.20.3 Initial Carrier Frequency Tolerance 118
5.20.4 Carrier Frequency Drift 119
5.20.5 VCO Drift 120
5.20.6 Frequency Pulling and Pushing 120
5.21 Receiver Tests 124
5.21.1 Bit Error Rate 125
5.21.2 Bit Error Rate Methods 127
5.21.3 Programmable Delay Line Method (XOR Method) 127
5.21.4 Field Programmable Gate Array Method 128
5.21.5 BER Testing with a Digital Pin 128
5.21.6 BER Measurement with a Digitizer 130
5.22 BER Receiver Measurements 132
5.22.1 Sensitivity BER Test 132
5.22.2 Carrier-to-Interference BER Tests 133
5.22.3 Cochannel Interference BER Tests 133
5.22.4 Adjacent Channel Interference BER Tests 133
5.22.5 Inband and Out-of-Band Blocking BER Tests 135
5.22.6 Intermodulation Interference BER Tests 135
5.22.7 Maximum Input Power Level BER Test 137
5.23 EVM Introduction 137
5.23.1 I/Q Diagrams 137
5.23.2 Definition of Error Vector Magnitude 138
5.23.3 Making the Measurement 139
5.23.4 Related Signal Quality Measurements 141
5.23.5 Comparison of EVM with More Traditional Methods
of Testing 142
5.23.6 Should EVM Be Used for Production Testing? 142
References 143
CHAPTER 6
Fundamentals of Analog and Mixed-Signal Testing 145
6.1 Introduction 145
6.2 Sampling Basics and Conventions 145
6.2.1 DC Offsets and Peak-to-Peak Input Voltages 146
6.3 The Fourier Transform and the FFT 147
6.3.1 The Fourier Series 147
6.3.2 The Fourier Transform 147
6.3.3 The Discrete Fourier Transform 149
6.3.4 The Fast Fourier Transform 150
6.4 Time-Domain and Frequency-Domain Description and
Dependencies 150
6.4.1 Negative Frequency 150
6.4.2 Convolution 151
6.4.3 Frequency- and Time-Domain Transformations 152 - 第一部分
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