科普:MEMS:Microelectromechanical System
MEMS是微机电系统的缩写。MEMS主要包括微型机构、微型传感器、微型执行器和相应的处理电路等几部分,它是在融合多种微细加工技术,并应用现代信息技术的最新成果的基础上发展起来的高科技前沿学科。
微机电系统MEMS(Micro-Electro-Mechanical Systems)是一种全新的必须同时考虑多种物理场混合作用的研发领域,相对于传统的机械,它们的尺寸更小,最大的不超过一个厘米,甚至仅仅为几个微米,其厚度就更加微小。采用以硅为主的材料,电气性能优良,硅材料的强度、硬度和杨氏模量与铁相当,密度与铝类似,热传导率接近钼和钨。采用与集成电路(IC)类似的生成技术,可大量利用IC生产中的成熟技术、工艺 ,进行大批量、低成本生产,使性价比相对于传统“机械”制造技术大幅度提高。
完整的MEMS是由微传感器、微执行器、信号处理和控制电路、通讯接口和电源等部件组成的一体化的微型器件系统。其目标是把信息的获取、处理和执行集成在一起,组成具有多功能的微型系统,集成于大尺寸系统中,从而大幅度地提高系统的自动化、智能化和可靠性水平。
Microengineering, Mems, And Interfacing: A Practical Guide
Author:Daniel John Banks
Publisher:CRC Press(March 23, 2006)
Pages:310
ISBN-10:0-8247-2305-8
ISBN-13:978-0-8247-2305-7
Format:
PDF,13.7 MB
(大杀器)报价:¥1,034
Contents:
Part 1 Micromachining
Chapter 1 Photolithography
Chapter 2 Silicon Micromachining
Chapter 3 Nonsilicon Processes
Chapter 4 Mask Design
Part II Microsystems
Chapter 5 Microsensors
Chapter 6 Microactuators
Chapter 7 Micro Total Analysis Systems
Chapter 8 Integrated Optics
Chapter 9 Assembly and Packaging
Chapter 10 Nanotechnology
Part III Interfacing
Chapter 11 Amplifiers and Filtering
Chapter 12 Computer Interfacing
Chapter 13 Output Drivers
Designed to address particular problems across a range of disciplines, Microengineering, MEMS, and Interfacing: A Practical Guide provides a general overview of micromachining techniques and presents micromachining approaches to problem solving. The author outlines techniques for micromachining materials, including silicon, metals, and polymers, and then illustrates how to combine these technologies to create a variety of structures and devices. He also includes discussions on nanotechnology and how it overlaps with microengineering, introduces the subject of sensor interfacing, and raises the tricky subject of MEMS packaging.
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